Top emission device and organic light-emitting diode display device

ABSTRACT

An organic light-emitting diode display device includes a first substrate that includes a display region with a plurality of pixels and a non-display region in a periphery of the display region, a first electrode disposed on the first substrate, a second electrode opposed to the first electrode, an organic light-emitting layer disposed between the first electrode and the second electrode, and at least one light sensing member disposed on a rear surface of the first substrate that overlaps the display region.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. application Ser. No.15/018,335, filed on Feb. 8, 2016 in the U.S. Patent and TrademarkOffice, which in turn claims priority under 35 U.S.C. §119 from, and thebenefit of, Korean Patent Application No. 10-2015-0019251 filed on Feb.9, 2015 and Korean Patent Application No. 10-2015-0019247 filed on Feb.9, 2015 in the Korean Intellectual Property Office, the contents ofwhich are herein incorporated by reference in their entireties.

BACKGROUND

1. Technical Field

Embodiments of the present disclosure are directed to a top emissiondevice and an organic light-emitting diode display device, and moreparticularly, to a top emission device and a top emission type organiclight-emitting diode display device emitting light mainly to a frontsurface thereof.

2. Discussion of the Related Art

Light emitting devices, which are devices that provide light, are usedin the fields of lightings or displays. For example, an organiclight-emitting diode display device can include a plurality of organiclight-emitting devices and can control the amount of light emitted fromthe respective organic light-emitting devices to display an image. Alight emitting layer of a organic light-emitting device emits lightthrough two surfaces thereof, and if a screen is viewed in onedirection, the device may be provided with a reflective electrode or areflective layer to reflect light emitted therefrom in a screen displaydirection.

A case in which an organic light-emitting device is disposed in front ofa substrate, and light is emitted in a direction toward the substrate iscommonly referred to as bottom emission, while a case in which light isemitted in a front direction that is opposite to the direction towardthe substrate is commonly referred to as ‘top emission’. A bottomemission type organic light-emitting diode display device may employ atop electrode of an organic light-emitting device as a reflectiveelectrode to emit light to a rear surface thereof. On the other hand, atop emission type organic light-emitting diode display device mayinclude a reflective electrode or a reflective layer in a lowerelectrode of an organic light-emitting device.

In addition, a degree of degradation in an organic light-emitting diodedisplay device may vary depending on how much current accumulates ineach pixel. If degradation has been detected so that the currentprovided to a corresponding pixel can be compensated, deterioration ofimage quality due to the degradation may be prevented. To this end, theluminance of emitted light should be determined.

For a bottom emission type display device, since light that is laterallyleaking may be reflected from the interior of a display panel and maypropagate laterally through the display panel, light emitted from pixelsmay be detected when an light sensor is provided on a side surface ofthe display panel. On the basis of this, a pixel light emissionintensity can be estimated. However, for a top emission type displaydevice, since a transparent electrode or a translucent electrode is usedas a top electrode, the intensity of laterally propagating light may below. Thus, even if a light sensor is installed on a side surface of thedisplay panel, it may not precisely detect and estimate the lightintensity emitted from the pixels.

SUMMARY

Embodiments of the present disclosure can provide an organiclight-emitting diode display device in which a luminance of lightemitted from a pixel may be easily sensed.

Embodiments of the present disclosure can also provide a top emissiondevice in which a luminance of emitted light may be easily sensed.

According to an embodiment of the present inventive concept, there isprovided an organic light-emitting diode display device comprising: afirst substrate that includes a display region with a plurality ofpixels and a non-display region in a periphery of the display region; afirst electrode disposed on the first substrate; a second electrodeopposed to the first electrode; an organic light-emitting layer disposedbetween the first electrode and the second electrode; and at least onelight sensing member disposed on a rear surface of the first substratethat overlaps the display region.

The light sensing member may include a light sensor and a lightcollecting member that transmits light received from the first substrateto the light sensor.

The light collecting member may include a light collecting body and alight-modulating structure disposed in the light collecting body.

The light sensor may be disposed adjacent to one side of the lightcollecting body.

The light-modulating structure may include a plurality of prism patternsthat correspond to the plurality of pixels.

The prism patterns may be disposed along each column or row of thepixels corresponding thereto in a one-to-one correspondence.

The light-modulating structure may have a single continuous slopedsurface.

An inclination angle of the sloped surface may decrease with decreasingdistance to the light sensor.

The light-modulating structure may include alternating first and secondsurfaces that have different inclination angles.

A width of a repeating unit of the first surface and the second surfacemay be identical to a pitch of the pixels corresponding to the repeatingunit.

A top surface of the light collecting body may be a light input surface,a side surface of the light collecting body adjacent to the light sensormay be a light output surface, and the light collecting member mayfurther include a reflective member disposed on those surfaces otherthan the light input surface and the light output surface of the lightcollecting body.

The light sensor may be disposed on a rear surface adjacent to one sideof the light collecting body.

The light-modulating structure may include a first light path changingstructure that changes a light path to a horizontal direction and asecond light path changing structure that changes a light path to avertical direction.

A plurality of light sensing members may be provided that are spacedapart from each other.

The display region may include a central portion and a circumferentialportion surrounding the central portion, and the light sensing membermay be disposed in the circumferential portion of the display region.

The circumferential portion may include a degradation-expected region,and the light sensing member may at least partially overlap thedegradation-expected region.

The display region may further include a comparative region adjacent tothe degradation-expected region, the light collecting member may overlapthe degradation-expected region, and the light sensor may overlap thecomparative region.

The organic light-emitting diode display device may further comprise aheat radiating member disposed on the rear surface of the firstsubstrate.

The heat radiating member may include a hole, and the light sensingmember may be inserted into the hole and is disposed adjacent to therear surface of the first substrate.

The organic light-emitting diode display device may further comprise anadhesive member disposed between the first substrate and the lightsensing member.

According to another embodiment of the present inventive concept, thereis provided a top emission device comprising: a bottom device unit; atop device unit opposed to the bottom device unit; a light emittingdevice unit interposed between the bottom device unit and the top deviceunit; and at least one light sensing member disposed in a rear of thebottom device unit that overlaps a light transmitting region of the topdevice unit.

The light sensing member may include a light sensor and a lightcollecting member that transmits light received from the bottom deviceunit to the light sensor.

The light collecting member may include a light collecting body and alight-modulating structure disposed in the light collecting body.

A plurality of light sensing members may be provided that are spacedapart from each other.

The light sensing member may at least partially overlap adegradation-expected region in the light emitting device unit.

The top emission device may further comprise a heat radiating memberdisposed on the rear surface of the first substrate and that includes ahole, wherein the light sensing member is inserted into the hole and isdisposed adjacent to the rear surface of the first substrate.

According to another embodiment of the present inventive concept, thereis provided an organic light-emitting diode display device, comprising afirst substrate that includes a display region with a plurality ofpixels and a non-display region in a periphery of the display region;and at least one light sensing member disposed on a rear surface of thefirst substrate that overlaps the display region. The light sensingmember includes a light sensor and a light collecting member thattransmits light received from the first substrate to the light sensor,and the light collecting member includes a light collecting body and alight-modulating structure disposed in the light collecting body.

The organic light-emitting diode display device may further include afirst electrode disposed on the first substrate, a second electrodeopposed to the first electrode, and an organic light-emitting layerdisposed between the first electrode and the second electrode.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic diagram of a top emission device according to anexemplary embodiment of the present disclosure.

FIG. 2 is a plan view of an organic light-emitting diode display deviceaccording to an exemplary embodiment of the present disclosure.

FIG. 3 is a rear view of an organic light-emitting diode display deviceaccording to an exemplary embodiment of the present disclosure.

FIG. 4 is a plan view of an organic light-emitting diode display deviceaccording to another exemplary embodiment of the present disclosure.

FIG. 5 is a rear view of an organic light-emitting diode display deviceaccording to another exemplary embodiment of the present disclosure.

FIG. 6 is a schematic cross-sectional view of an organic light-emittingdiode display device according to an exemplary embodiment of the presentdisclosure.

FIG. 7 is a cross-sectional view of a pixel structure of an organiclight-emitting diode display device according to an exemplary embodimentof the present disclosure.

FIG. 8 is a plan view of a light sensing member of an organiclight-emitting diode display device according to an exemplary embodimentof the present disclosure.

FIG. 9 is a cross-sectional view of a light sensing member of an organiclight-emitting diode display device according to an exemplary embodimentof the present disclosure.

FIG. 10 is a cross-sectional view of a light sensing member of anorganic light-emitting diode display device according to anotherexemplary embodiment of the present disclosure.

FIG. 11 is a cross-sectional view of a light sensing member of anorganic light-emitting diode display device according to anotherexemplary embodiment of the present disclosure.

FIG. 12 is a cross-sectional view of a light sensing member of anorganic light-emitting diode display device according to anotherexemplary embodiment of the present disclosure.

FIG. 13 is a cross-sectional view of a light sensing member of anorganic light-emitting diode display device according to anotherexemplary embodiment of the present disclosure.

FIG. 14 is a cross-sectional view of a light sensing member of anorganic light-emitting diode display device according to anotherexemplary embodiment of the present disclosure.

FIG. 15 is a cross-sectional view of a light sensing member of anorganic light-emitting diode display device according to anotherexemplary embodiment of the present disclosure.

FIG. 16 is a cross-sectional view of a light sensing member of anorganic light-emitting diode display device according to anotherexemplary embodiment of the present disclosure.

FIG. 17 is a rear view of an organic light-emitting diode display deviceaccording to another exemplary embodiment of the present disclosure.

FIG. 18 is a cross-sectional view of an organic light-emitting diodedisplay device according to another exemplary embodiment of the presentdisclosure.

FIG. 19 is a cross-sectional view of an organic light-emitting diodedisplay device according to another exemplary embodiment of the presentdisclosure.

FIG. 20 is a cross-sectional view of an organic light-emitting diodedisplay device according to another exemplary embodiment of the presentdisclosure.

DETAILED DESCRIPTION

Features of embodiments of the present disclosure and methods ofaccomplishing the same may be understood more readily by reference tothe following detailed description of exemplary embodiments and theaccompanying drawings. Embodiments of the present disclosure may,however, be embodied in many different forms and should not be construedas being limited to the embodiments set forth herein.

It will be understood that when an element or layer is referred to asbeing “on” another element or layer, it can be directly on the otherelement or layer or intervening elements or layers may be present. Likenumbers may refer to like elements throughout.

In the specification, a light emitting device refers to a deviceproviding light and for example, may include a lighting device or adisplay device such as an organic light-emitting diode display device,an inorganic light-emitting diode display device, a plasma displaydevice, etc., displaying an image using light.

Hereinafter, exemplary embodiments of the present disclosure will bedescribed. with reference to the drawings.

FIG. 1 is a schematic diagram of a top emission device according to anexemplary embodiment of the present disclosure. Referring to FIG. 1, atop emission device 10 includes a bottom device unit 11, a lightemitting device unit 12, a top device unit 13, and a light sensingmember 300.

In the specification, the term ‘single-sided light emission’ refers toemission of light mainly to one of two surfaces of a device. Inaddition, the term ‘top emission’ refers to emission of light mainly toa front surface of front and rear surfaces. Here, the emission of lightmainly to the front surface means that the amount of light emitted tothe front surface is greater than the amount of light emitted to therear surface, and for example, corresponds to a case in which 70% ormore or 90% or more of a total light emission amount is emitted to thefront surface.

The light emitting device unit 12 may include at least one lightemitting device 12 a. The light emitting device 12 a may be, forexample, an organic light-emitting device, but the present disclosure isnot limited thereto.

For top emission, a single-sided light emitting device may be used asthe light emitting device 12 a. Cases of a single-sided light emittingdevice include a device that emits light to a single surface byappropriately including an optical member although the device may emitlight to two surfaces, as well as a device that itself emits light to asingle surface. For example, a top emission type organic light-emittingdevice may emit light to two surfaces thereof, but mostly emits light toa front surface thereof by adjusting electrode properties andtransmittance, reflectance, etc. Therefore, a top emission type organiclight-emitting device may be interpreted as corresponding to asingle-sided light emitting device.

According to an embodiment, the bottom device unit 11 is disposed behindthe light emitting device unit 12, and the top device unit 13 isdisposed in front of the light emitting device unit 12. The lightemitting device unit 12 is interposed between the bottom device unit 11and the top device unit 13 for protection.

According to an embodiment, a light transmitting path 11 a through thebottom device unit 11 provides light to the light sensing member 300,which is not in a main emission direction of light. If a light emissiondirection of the light emitting device 12 a is double-sided or is a reardirection, the bottom device unit 11 may include a reflective member.

According to an embodiment, the bottom device unit 11 includes wiringsfor driving the light emitting device 12 a, an electrode, an insulatinglayer, etc.

Since the top device unit 13 is disposed in a primary emission directionof light 1, the top device unit 13 includes a region, such as a displayregion, capable of at least partially transmitting light. The top deviceunit 13 may include a color filer to implement specific colors, butembodiments are not limited thereto. In addition, according to anembodiment, the top device unit 13 includes a light modulating member,such as a prism film, a diffusion film, a micro-lens film etc., thatmodifies light characteristics of light L1 emitted from the top deviceunit 13.

According to an embodiment, at least one light sensing member 300 isdisposed at the rear of the bottom device unit 11. The light sensingmember 300 directly receives leaked light L2 that has propagated fromthe light emitting device unit 12 through the bottom device unit 11, andacquires a light-emitting luminance value from the light. The lightsensing member 300 overlaps a region of the top device unit 13 thattransmits light L1.

Hereinafter, a more detailed description will be presented withreference to an organic light-emitting diode display device as the topemission device.

FIG. 2 is a plan view of an organic light-emitting diode display deviceaccording to an exemplary embodiment of the present disclosure.

Referring to FIG. 2, an organic light-emitting diode display device 500can be divided into a display region PA and a non-display region NRAthat surrounds the display region PA.

According to an embodiment, the display region PA includes a pluralityof pixels PX. The respective pixels PX are arranged in a matrix form.The respective pixels PX are allocated to display specific colors. Forexample, the plurality of pixels PX may include an R pixel displayingred, a G pixel displaying green, and a B pixel displaying blue. The Rpixel, G pixel, and B pixel are alternately arranged to display variouscolors.

The display region PA may have a rectangular shape, but is not limitedthereto. The display region PA may have a square shape, a circularshape, an oval shape, etc.

According to an embodiment, the non-display region NPA is positioned inthe periphery of the display region PA. The non-display region NPA doesnot display an image, and a light-shielding member such as a blackmatrix is disposed therein. The non-display region NPA forms a bezelportion of the organic light-emitting diode display device 500. Variousdriving devices that drive the pixels PX can be disposed in thenon-display region NPA. Pixels PX may also be disposed within thenon-display region NPA, but in this case, those pixels PX disposedwithin the non-display region NPA are dummy pixels that not externallyvisible.

FIG. 3 is a rear view of a organic light-emitting diode display deviceaccording to an exemplary embodiment of the present disclosure.

Referring to FIG. 3, at least one light sensing member 300 is disposedbehind the organic light-emitting diode display device 500. When aplurality of light sensing members 300 are disposed, the respectivelight sensing members 300 are spaced apart from each other.Alternatively, two or more light sensing members 300 may be adjacent toeach other to form a single light sensing member group, and a pluralityof light sensing member groups are spaced apart from each other.According to an embodiment, the light sensing members 300 are disposedin a region that overlaps the display region PA.

According to an embodiment, each light sensing member 300 overlaps aplurality of pixels PX. For example, the light sensing member 300 extendin one direction and may overlap two or more pixels PX in a length (l)direction. The light sensing member 300 may overlap one pixel PX or twoor more pixels PX in a width (w) direction. When the light sensingmember 300 overlaps two or more pixels PX in the width (w) direction,the number of pixels PX overlapped therein may be less than the numberof pixels PX overlapped in the length (l) direction. FIG. 3 illustratesa case in which the length (l) direction of the light sensing member 300corresponds to a column direction of the pixels PX. However,alternatively, the length (l) direction of the light sensing member 300may correspond to a row direction of the pixels PX. In addition, thelength (l) direction of the light sensing member 300 may be a directiondiagonal to the column direction of the pixels PX and the row directionof the pixels PX.

According to an embodiment, the respective light sensing members 300 areuniformly, widely spread over the display region PA. For example, asillustrated in FIG. 3, the light sensing members 300 are disposed in thevicinity of four corners, namely left-top portion, a right-top portion,a left-bottom portion and a right-bottom portion, and a central portionof the display region PA.

According to an embodiment, the light sensing members 300 disposed inthe left-top portion and the right-bottom portion are symmetric withrespect to each other with respect to the light sensing member 300disposed in the central portion of the display region PA. The lightsensing members 300 disposed in the right-top portion and theleft-bottom portion are symmetric with respect to each other the lightsensing member 300 disposed in the central portion of the display regionPA. In this manner, when the light sensing members 300 are uniformlyspread over the entirety of the display region PA, a luminance value ofthe overall display region PA can be easily estimated using luminanceinformation acquired by the light sensing members 300.

Alternatively, the light sensing members 300 may be selectively disposedin pixel PX regions having a high possibility of degradation and can beused to determine a degree of degradation in the corresponding pixel PXregion. A more detailed description will be made with reference to FIG.4 and FIG. 5.

FIG. 4 is a plan view of an organic light-emitting diode display deviceaccording to another exemplary embodiment of the present disclosure.

FIG. 5 is a rear view of an organic light-emitting diode display deviceaccording to another exemplary embodiment of the present disclosure. Inthe exemplary embodiment of FIG. 4 and FIG. 5, the same components asthose of the foregoing exemplary embodiment of FIG. 2 and FIG. 3 arereferred to using the same reference numerals and a repeated explanationis omitted or simplified.

Referring to FIG. 4 and FIG. 5, an organic light-emitting diode displaydevice 501 according to an exemplary embodiment includes a displayregion PA and a non-display region NPA surrounding the display regionPA. The display region PA of the organic light-emitting diode displaydevice 501 according to an exemplary embodiment includes a centralportion and a circumferential portion surrounding the central portion. Awidth of the central portion in one direction may be equal to or greaterthan a width of the circumferential portion adjacent to the centralportion in a width direction. If the display region PA is divided intothree equal parts, such as one circumferential portion, a centralportion, and another circumferential portion, in a direction parallel toone side of the display region PA, the widths of the central portion andthe circumferential portion are identical to each other.

According to an embodiment, the circumferential portion of the displayregion PA includes a degradation-expected region, for example, anafterimage-expected region AIR. The afterimage-expected region AIR is aregion having a high probability of deterioration, such as an occurrenceof an afterimage.

For example, a video image received from broadcasting system may includea broadcaster logo positioned in a right top portion of a screen. Anexemplary broadcaster logo “SDC” is displayed in the AIR of FIG. 4. Thebroadcaster logo maintains an identical image in a correspondingposition even as the video image changes. Thus, as the pixels PX in thecorresponding position display an identical luminance and color for anidentical image over a long period of time, the possibility that thepixels PX degrade is high, and an afterimage phenomenon can occur. Aposition in which an actual afterimage occurs may vary according to adisplayed image. A region having a high probability that an afterimagefrequently occurs may be set as the afterimage-expected region AIR.

In an exemplary embodiment, the afterimage-expected region AIR isdisposed at an edge of the circumferential portion of the display regionPA. For example, the afterimage-expected region AIR may be set in theright top portion of the display region PA. Alternatively, theafterimage-expected region AIR may also be set in the left top portion,the left bottom portion, and/or the right bottom portion of the displayregion PA.

The afterimage-expected region AIR may be provided in plural, and inthis case, the plurality of respective afterimage-expected regions maybe spaced apart from each other.

According to an embodiment, the afterimage-expected region AIR includesa plurality of pixels PX. For example, the afterimage-expected. regionAIR extends in one direction and includes two or more pixels PX in thelength (l) direction. The afterimage-expected region AIR may include onepixel PX or two or more pixels PX in the width (w) direction. When theafterimage-expected region AIR includes two or more pixels PX in thewidth (w) direction, the number of pixels PX included in the width (w)direction may be less than the number of pixels PX included in thelength (l) direction. FIG. 4 and FIG. 5 illustrate a case in which thelength (l) direction of the afterimage-expected region AIR correspondsto a column direction of the pixels PX. However, alternatively, thelength (l) direction of the afterimage-expected region AIR maycorrespond to a row direction of the pixels PX. In addition, the length(l) direction of the afterimage-expected region AIR may be a directiondiagonal to the column direction of the pixels PX and the row directionof the pixels PX.

According to an embodiment, the light sensing member 300 overlaps thedisplay region PA. The light sensing member 300 is disposed in thecircumferential portion of the display region PA. Further, the lightsensing member 300 may at least partially overlap theafterimage-expected region AIR. When the afterimage-expected region AIRis provided in plural, the light sensing member 300 is also be providedin plural, and the plurality of light sensing members 300 may be atleast partially overlap the respective afterimage-expected regions AIR.The light sensing member 300 may have a shape similar to that of theafterimage-expected region AIR, for example, a shape that extends in onedirection.

According to an embodiment, the light sensing member 300 that overlapsthe afterimage-expected region AIR can directly receive leakage lightfrom the afterimage-expected region AIR. Luminance informationdetermined in this manner may be used to determine a degree ofdegradation in a corresponding region.

In detail, when light is emitted by applying a data signal to theafterimage-expected region AIR, light leaking from theafterimage-expected region AIR is received by the light sensing member300. The light sensing member 300 provides corresponding luminanceinformation to a controller. The controller can estimate the luminanceactually emitted from a corresponding region, using luminanceinformation received from the light sensing member 300. One method ofestimating an actual emitted luminance value involves reading anestimated luminance value from a look-up table stored in a memory.However, embodiments of the present disclosure are not limited thereto,and an actual luminance value may be estimated by various methodscommonly known in the art. In addition, whether or not degradationoccurs may be confirmed using only the provided luminance information,without estimating the actual luminance value.

According to an embodiment, the luminance value provided to thecontroller, or the estimated luminance value, is compared with the inputdata signal, and whether the luminance value is an appropriate luminancevalue can be determined. If the luminance value is less than the datasignal, a compensation signal may be generated and if light is emittedfrom the afterimage-expected region AIR, a correction data signal formedby adding the compensation signal to the data signal is applied, suchthat luminance of the afterimage-expected region AIR may be compensatedto an appropriate level.

According to an embodiment, the measurement of the luminance value andthe generation of the compensation signal can be continuously performedwhile displaying an image on the organic light-emitting diode displaydevice 500, and may also be periodically performed. In addition, if animage is received which is expected to induce an afterimage, themeasurement of the luminance value and the generation of thecompensation signal can be performed. Alternatively, the measurement ofthe luminance value and the generation of the compensation signal may beperformed immediately after turning-on or turning-off the organiclight-emitting diode display device 501.

Hereinafter, an organic light-emitting diode display device isillustrated in the embodiments of FIG. 2 and FIG. 3, but it may beobvious that the organic light-emitting diode display device may besubstituted with the example of FIG. 4 and FIG. 5.

Referring to FIG. 6, a cross-sectional structure of the organiclight-emitting diode display device 500 illustrated in FIG. 2 isdescribed. FIG. 6 is a schematic cross-sectional view of an organiclight-emitting diode display device according to an exemplary embodimentof the present disclosure.

Referring to FIG. 6, a first substrate 100 and a second substrate 200are opposed to each other, and organic light-emitting devices OLED aredisposed in the display region PA therebetween. The first substrate 100may be a thin film transistor substrate, and the second substrate 200may be a sealing substrate. The organic light-emitting devices OLED aredivided and disposed in respective pixels. A sealing material 250 isinterposed between the first substrate 100 and the second substrate 200in the non-display region NPA. The sealing material 250 can couple thefirst substrate 100 and the second substrate 200 while protecting theinternal organic light-emitting devices OLED. The light sensing member300 can be attached to a rear surface of the first substrate 100.

Alternatively, unlike the exemplary embodiment illustrated in FIG. 6, asealing layer formed of an insulating material can be used, instead ofthe second substrate 200. In this case, the sealing material 250 can beomitted and the sealing layer can be formed directly on the firstsubstrate 100 and coupled thereto.

Hereinafter, a pixel structure of the organic light-emitting diodedisplay device 500 will be explained in more detail.

FIG. 7 is a cross-sectional view of a pixel structure of an organiclight-emitting diode display device according to an exemplary embodimentof the present disclosure.

Referring to FIG. 7, the organic light-emitting diode display device 500includes the first substrate 100, an organic light-emitting devicedisposed on the first substrate 100, and the second substrate 200disposed above the organic light-emitting device. The organiclight-emitting device includes a first electrode 110, a second electrode120 opposed to the first electrode 110, and an organic light-emittinglayer 130 interposed between the first electrode 110 and the secondelectrode 120. A first charge transfer region 140 is disposed betweenthe first electrode 110 and the organic light-emitting layer 130. Inaddition, a second charge transfer region 150 is disposed between theorganic light-emitting layer 130 and the second electrode 120.

One of the opposing first and second electrodes 110 and with the organiclight-emitting layer 130 interposed therebetween may be an anodeelectrode and the other thereof may be a cathode electrode. In addition,one of the first and second charge transfer regions 140 and 150 maytransfer holes, and the other thereof may transfer electrons.

The exemplary embodiment of FIG. 7 illustrates a case in which the firstelectrode 110 is an anode electrode and the second electrode 120 is acathode electrode. Accordingly, the first charge transfer region 140adjacent to the anode electrode is a hole transfer region and the secondcharge transfer region 150 adjacent to the cathode electrode is anelectron transfer region.

According to an embodiment, the first substrate 100 includes aninsulating substrate. The insulating substrate may be formed of amaterial such as glass, quartz, polymer resin, etc. Examples of apolymer resin include polyethersulphone (PES), polyacrylate (PA),polyarylate (PAR), polyetherimide (PEI), polyethylene napthalate (PEN),polyethylene terepthalate (PET), polyphenylene sulfide (PPS),polyallylate, polyimide (PI), polycarbonate (PC), cellulose triacetate(CAT or TAC), cellulose acetate propionate (CAP), or combinationsthereof. In some exemplary embodiments, the insulating substrate is aflexible substrate formed of a flexible material such as polyimide (PI).

In addition, according to embodiments, the first substrate 100 includesother structures disposed on the insulating substrate. Examples of theother structures include wirings for driving the organic light-emittingdevice, an electrode, an insulating layer, etc. In some exemplaryembodiments, the first substrate 100 includes a plurality of thin filmtransistors disposed on the insulating substrate. A drain electrode ofthe plurality of thin film transistors is electrically connected to thefirst electrode 110. The thin film transistors include active regionsformed of amorphous silicon, polycrystalline silicon, mono-crystallinesilicon, etc. In another exemplary embodiment, the thin film transistorsinclude active regions formed of an oxide semiconductor.

According to an embodiment, the first electrode 110 is disposed on thefirst substrate 100. The first electrode 110 is disposed in each pixelof the organic light-emitting diode display device 500. The firstelectrode 110 contains a conductive material having a relatively highwork function as compared to the second electrode 120. For example, thefirst electrode 110 may include Indium-Tin-Oxide (ITO),Indium-Zinc-Oxide (IZO), Zinc Oxide (ZnO), Indium Oxide (In₂O₃), etc.The first electrode 110 may further contain a reflective material, suchas silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), lead (Pd),gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr),lithium (Li), calcium (Ca), or combinations thereof, in addition to theconductive material. Thus, the first electrode 110 may have a singlelayer structure formed of the conductive material and the reflectivematerial or a multilayer structure having them stacked therein. In thecase of a multilayer structure, a top layer adjacent to the first chargetransfer region 140 can be formed of a conductive material having a highwork function. For example, the first electrode 110 may have amultilayer structure of ITO/Mg, ITO/MgF, ITO/Ag, or ITO/Ag/ITO, but isnot limited thereto.

According to an embodiment, a pixel defining layer 160 is disposed onthe first substrate 100. The pixel defining layer 160 is arranged in alattice form along boundaries of pixels and physically divides therespective pixels. The pixel defining layer 160 may at least partiallyexpose the first electrode 110. For example, the pixel defining layer160 can be disposed to overlap an edge portion of the first electrode110. The pixel defining layer 160 defines pixel partitions, and theorganic light-emitting layer 130 is disposed within each space definedby the pixel defining layer 160. In addition, a spacer may be disposedon the pixel defining layer 160. In this case, an end of the spacer maybe adjacent to or may contact the second substrate 200.

According to an embodiment, the first charge transfer region 140 isdisposed on the first electrode 110. The first charge transfer region140 may have a single layer structure formed of a single material, maybe formed of a plurality of different materials, or may have amultilayer structure including a plurality of layers formed of aplurality of different materials. In addition, the first charge transferregion 140 may further include a buffer layer and a first chargeblocking layer. Although FIG. 7 illustrates a case in which the firstcharge transfer region 140 includes a first charge injection layer 141and a first charge transport layer 142, one of the first chargeinjection layer 141 and the first charge transport layer 142 can beomitted or the layers can be configured as a single layer.

According to an embodiment, the first charge injection layer 141 isdisposed on the first electrode 110 and increases efficiency ofinjecting holes into the organic light-emitting layer 130 from the firstelectrode 110. Specifically, the first charge injection. layer 141lowers an energy barrier to allow for more effective injection of theholes.

According to an embodiment, the first charge injection layer 141contains a phthalocyanine compound such as copper phthalocyanine (CuPc),m-MTDATA (4,4′,4″-tris(N-3-methylphenyl-N-phenylamino)triphenylamine),TDATA (4,4′,4″-tris(diphenylamino)triphenylamine), 2-TNATA(4,4′,4″-tris[2-naphthyl(phenyl)amino]triphenyl-amine), Pani/DBSA(Polyaniline/Dodecylbenzenesulfonic acid), PEDOT/PSS (Poly(3,4-ethylenedioxythiophene)/Polystyrene sulfonate), PANI/CSA(Polyaniline/Camphorsulfonic acid), or PANI/PSS (Polyaniline/Polystyrenesulfonate).

According to an embodiment, the first charge transport layer 142 isdisposed on the first charge injection layer 141 and transports theholes injected into the first charge injection layer 141 to the organiclight-emitting layer 130. When the energy level of the highest occupiedmolecular orbital (HOMO) of the first charge transport layer 142 issubstantially lower than a work function of a material of the firstelectrode 110 and is substantially higher than the highest occupiedmolecular orbital (HOMO) of the organic light-emitting layer 130,hole-transporting efficiency may be optimized. The first chargetransport layer 142 may contain, for example, NPD(4,4′-bis[N-(1-napthyl)-N-phenyl-amino]biphenyl), TPD(N,N′-diphenyl-N,N′-bis[3-methylphenyl]-1,1′-biphenyl-4,4′-diamine),s-TAD(2,2′,7,7′-tetrakis-(N′,N-diphenylamino)-9,9′-spirobifluoren),m-MTDATA (4,4′,4″-tris(N-3-methylphenyl-N-phenylamino)triphenylamine),etc., but is not limited thereto.

According to an embodiment, the first charge transfer region 140 alsoincludes charge generating materials to improve conductivity, inaddition to the materials previously mentioned above. The chargegenerating materials may be uniformly or non-uniformly dispersed withinthe first charge transfer region 140. The charge-generating material maybe, for example, a p-dopant. The p-dopant may be one of a quinonederivative, a metal oxide, or a compound with a cyano group, but is notlimited thereto. Non-limiting examples of the p-dopant include quinonederivatives such as tetracyanoquinodimethane (TCNQ) and2,3,5,6-tetrafluoro-tetracyano-1,4-benzoquinodimethane (F4-TCNQ); metaloxides such as a tungsten oxide and a molybdenum oxide; etc.

In addition, according to an embodiment, the first charge transferregion 140 includes at least one of a buffer layer and a first chargeblocking layer. The buffer layer compensates for a resonance distance oflight as a function of a wavelength of the light emitted from theorganic light-emitting layer 130, and thus can increase light emissionefficiency. The buffer layer may include the same material as thatincluded in the first charge transfer region 140. The first chargeblocking layer can prevent charges from being injected into the firstcharge transfer region 140 from the second charge transfer region 150.

According to an embodiment, the organic light-emitting layer 130 isdisposed on the first charge transfer region 140. A material of theorganic light-emitting layer 130 is not particularly limited as long asit is a light emitting material, and may be formed of, for example, amaterial that emits red light, green light and blue light. The organiclight-emitting layer 130 may contain a fluorescent or phosphorescentsubstance.

In an exemplary embodiment, the organic light-emitting layer 130includes a host and a dopant.

Examples of the host include Alq3(tris-(8-hydroxyquinolato)aluminum(III)), CBP(4,4′-N,N′-dicarbazole-biphenyl), PVK (poly(N-vinylcarbazole)), ADN(9,10-Bis(2-naphthalenyl)anthracene), TCTA(4,4′,4″-tris(Ncarbazolyl)triphenylamine), TPBi(1,3,5-tris(N-phenylbenzimiazole-2-yl)benzene), TBADN (2-(t-butyl)-9,10-bis(20-naphthyl) anthracene), DSA (distyrylarylene), CDBP(4,4′-Bis(9-carbazolyl)-2,2′-Dimethylbiphenyl), MADN(2-Methyl-9,10-bis(naphthalen-2-yl)anthracene), etc.

As the dopant, both a fluorescent dopant and a phosphorescent dopantcommonly known in the art can be used. A type of the dopant can varydepending on a light-emitting color of the organic light-emitting layer130.

A red dopant may be a fluorescent substance, including, for example, PBD(Eu(DBM)3(Phen)(2-biphenyl-4-yl-5-(4-t-butylphenyl)-1,3,4 oxadiazole(Tris(dibenzoylmethane) mono(1,10-phenanthroline)europium(III)) orperylene. Alternatively, the red dopant may be selected fromphosphorescent substances including metal complexes such as PIQIr(acac)(bis(1-phenylisoquinoline)acetylacetonate iridium), PQIr(acac)(bis(1-phenylquinoline)acetylacetonate iridium), PQIr(tris(1-phenylquinoline)iridium) and PtOEP(octaethylporphyrin platinum)or an organometallic complex.

A green dopant may be a fluorescent substance including, for example,Alq3 (tris-(8-hydroyquinolato)aluminum(III)). Alternatively, the greendopant may be a phosphorescent substance, such as Ir(ppy)3 (factris(2-phenylpyridine)iridium), Ir(ppy)2(acac)(Bis(2-phenylpyridine)(acetylacetonate)iridium(III)), Ir(mpyp)3(2-phenyl-4-methyl-pyridine iridium), etc.

A blue dopant may be a fluorescent substance, including spiro-DPVBi(spiro-4,′-bis(2,2′-diphenylvinyl)1,1′-biphenyl), spiro-6P(spiro-sixphenyl), DSB (distyrylbenzene), DSA (distyrylarylene), a PFO(polyfluorene)-based polymer and a PPV (poly p-phenylenevinylene))-based polymer. Alternatively, the blue dopant may be aphosphorescent substance, such as F2Irpic(bis[2-(4,6-difluorophenyl)pyridinato-N,C2′]iridium picolinate),(F2ppy)2Ir(tmd) (bis[2-(4,6-difluorophenyl)pyridinato-N,C2′]iridium2,2,6,6-tetramethylheptane-3,5-dione), Ir(dfppz)3(tris[1-(4,6-difluorophenyl)pyrazolate-N,C2′]iridium), etc.

According to an embodiment, the second charge transfer region 150 isdisposed on the organic light-emitting layer 130. The second chargetransfer region 150 may have a single layer structure formed of a singlematerial or formed of a plurality of different materials, or may have amultilayer structure that includes a plurality of layers formed of aplurality of different materials. In addition, the second chargetransfer region 150 may further include a second charge blocking layer.Although FIG. 7 illustrates a case in which the second charge transferregion 150 includes a second charge injection layer 151 and a secondcharge transport layer 152, one of the second charge injection layer 151and the second charge transport layer 152 can be omitted or the layerscan be configured as a single layer.

According to an embodiment, the second charge transport layer 152 isdisposed on the organic light-emitting layer 130 and transports theholes injected from the second charge injection layer 151 into theorganic light-emitting layer 130.

The second charge transport layer 152 may includeAlq3(tris-(8-hydroxyquinolato) aluminum(III)), TPBi(1,3,5-tris(N-phenylbenzimiazole-2-yl)benzene), BCP(2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline), Bphen(4,7-diphenyl-1,10-phenanthroline), TAZ(3(Biphenyl-4-yl)-5-(4-tert-butylphenyl)-4-phenyl-4H-1,2,4-triazole),NTAZ (4-(naphthalen-1-yl)-3,5-diphenyl-4H-1,2,4-triazole), tBu-PBD(2-(4-biphenylyl)-5-(4-tert-butyl-phenyl)-1,3,4-oxadiazole), BAlq(Bis(2-methyl-8-quinolinolato-N1,O8)-(1,1′-Biphenyl-4-olato)aluminum),Bebq2 (Bis(10-hydroxybenzo[h]quinolinato)beryllium), ADN(9,10-bis(2-naphthyl)anthracene), and combinations thereof, but is notlimited thereto.

According to an embodiment, the second charge injection layer 151 isdisposed on the second charge transport layer 152 and can increaseefficiency of injecting electrons into the organic light-emitting layer130 from the second electrode 120.

The second charge injection layer 151 may be a lanthanum metal such asLiF, LiQ (lithium quinolate), Li2O, BaO, NaCl, CsF or Yb, a metal halidesuch as RbCl or RbI, etc., but is not limited thereto. The second chargeinjection layer 151 may also be formed of a mixture of said materialsand insulating organo-metal salts. The organo-metal salts should have anenergy band gap of approximately 4 eV or greater. Specifically, theorgano-metal salts may contain, for example, a metal acetate, a metalbenzoate, a metal acetoacetate, a metal acetylacetonate, or a metalstearate.

In addition, according to an embodiment, the second charge transferregion 150 includes a second charge blocking layer. The second chargeblocking layer may contain, for example, at least one of BCP(2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline) and Bphen(4,7-diphenyl-1,10-phenanthroline), but is not limited thereto.

According to an embodiment, the second electrode 120 is disposed on thesecond charge transfer region 150. The second electrode 120 is a topelectrode or common electrode formed in a manner so that pixels are notdivided. The second electrode 120 contains a conductive material havinga relatively low work function as compared to the first electrode 110.

For example, the second electrode 120 may contain Li, Ca, LiF/Ca,LiF/Al, Al, Mg, Ag, Pt, Pd, Ni, Au Nd, Ir, Cr, BaF, Ba or compounds ormixtures thereof, such as a mixture of Ag and Mg, etc. According to anembodiment, the second electrode 120 is provided as a thin film and onthe second electrode 120, a transparent metal oxide, such asIndium-Tin-Oxide (ITO), (Indium-Zinc-Oxide (IZO), (Zinc Oxide (ZnO),(indium-Tin-Zinc-Oxide), etc, is stacked.

According to an embodiment, the second substrate 200 is disposed on thesecond electrode 120. The second substrate 200 includes an insulatingsubstrate. The second substrate 200 can be formed of the same materialsas the first substrate 100. In some exemplary embodiments, a blackmatrix, a color filer etc., is disposed on the second substrate 200.

According to an embodiment, the organic light-emitting devices formed onthe first substrate 100 and the second substrate 200 are spaced apartfrom each other. A space SPC interposed between the second substrate 200and the second electrode 120 may be vacant or may be filled with afiller formed of an organic material, etc.

When a first voltage is applied to the first electrode 110 and a secondvoltage lower than the first voltage is applied to the second electrode120, a current flows in a direction from the first electrode 110 to thesecond electrode 120, whereby the organic light-emitting layer 130 emitslight. Specifically, holes are injected into the first charge injectionlayer 141 from the first electrode 110 and are transported via the firstcharge transport layer 142 to the organic light-emitting layer 130. Inaddition, electrons are injected into the second charge injection layer151 from the second electrode 120 and are transported via the secondcharge transport layer 152 to the organic light-emitting layer 130. Whenholes and electrons meet to combine with each other in the organiclight-emitting layer 130, the light emitting material of the organiclight-emitting layer 130 is excited by the energy generated from thecombination. Light is emitted when the light emitting material returnsfrom the excited state to a ground state. The amount of emitted lightmay vary according to the amount of current flowing through the organiclight-emitting layer 130.

In addition, the propagation directions of light emitted from theorganic light-emitting layer 130 are randomly distributed. Basically,light can be emitted toward the rear toward the first substrate 100,emitted toward the front toward the second substrate 200, emittedlaterally, etc.

Light directed toward the rear, which is a bottom emission type, can bereflected from the first electrode 110 and propagate toward the front.In some cases, a portion of light may penetrate through the firstelectrode 110 and may enter the first substrate 100.

Light directed toward the front, which is a top emission type, canpenetrate through the second electrode 120. The conductive material ofthe second electrode 120 has a low work function, and may not itselftransmit light, but if the conductive material is a thin film,sufficient incident light can penetrate through the conductive material.A portion of light that does not penetrate through the second electrode120 is reflected.

Another portion of light propagates laterally through the pixel defininglayer 160. Another portion of light is reflected from the pixel defininglayer 160 to be directed toward the front and can penetrate through thesecond electrode 120, as described above. Another portion of light isreflected from the pixel defining layer 160 to be directed toward therear, and another portion of light is refracted into the pixel defininglayer.

A portion of light reflected in a rear direction from the pixel defininglayer 160 or light entering the interior of the pixel defining layer 160may be emitted to the first substrate 100 through a lower portion of thepixel defining layer 160 on which no first electrodes 110 are formed.Light emitted to the first substrate 100 in this manner is leakage lightthat does not contribute to displaying an image. Such leakage light canenter the light sensing member 300 disposed on the rear surface of thefirst substrate 100 and can be used to determine a degree of lightemission luminance or pixel degradation.

In addition, there can be other portions of light reflected in a reardirection from the pixel defining layer 160 or light entering theinterior of the pixel defining layer 160 that continuously propagatealong a lateral surface of the organic light-emitting diode displaydevice 500. Such light can be reflected from top and bottom electrodes,wirings, etc., and may laterally propagate a considerable distance.However, for the top emission type organic light-emitting diode displaydevice 500, the propagation distance thereof along the lateral surfacemay be less as compared to a bottom emission type device. For a bottomemission type, since a reflective electrode may be disposed in the frontof the device, and since other wirings may be disposed in the reardirection even if the first electrode is a transparent electrode, alateral propagation distance due to reflection may be considerable. Onthe other hand, for a top emission type, since the second electrode 120positioned in the front is a transparent electrode, the amount ofreflected light is reduced, and consequently, the amount of lighttransmitted through the lateral surface is reduced. Thus, for a bottomemission type, a considerable amount of light is transmitted to thenon-display region of the organic light-emitting diode display device,while for a top emission type, the amount of light transmitted to thenon-display region of the organic light-emitting diode display device isinsignificant. Due to this difference, an appropriate disposition of thelight sensing members 300 differs between a top emission device and abottom emission device. As in an exemplary embodiment, when the lightsensing member 300 is disposed within the display region, since thelight sensing member 300 can directly receive leakage light, effectivelight sensing is enabled even in the top emission device, without lossof leakage light.

Hereinafter, a light sensing member is described in more detail.

FIG. 8 is a plan view of a light sensing member of an organiclight-emitting diode display device according to an exemplary embodimentof the present disclosure. FIG. 9 is a cross-sectional view of a lightsensing member of an organic light-emitting diode display deviceaccording to an exemplary embodiment of the present disclosure.

Referring to FIG. 8 and FIG. 9, the light sensing member 300 includes alight sensor 310 and a light collecting member 320.

According to an embodiment, the light sensor 310 is disposed at one sideof the light collecting member 320. The light sensor 310 receivesleakage light L2 collected by the light collecting member 320 andmeasures luminance of the light. The light sensor 310 may include aphotodiode, a phototransistor, etc., but is not limited thereto. Variousdevices commonly known in the art may be used as a sensor to detectlight.

According to an embodiment, the light collecting member 320 includes alight collecting body 321. The light collecting body 321 includes alight input surface LS1 and a light output surface LS2. The light inputsurface LS1 and the light output surface LS2 are disposed at apredetermined angle, such as a right angle, with respect to each other.If the light collecting member 320 has a rectangular shape, the lightinput surface LS1 is a top surface of the light collecting body 321 andthe light output surface LS2 is a side surface of the light collectingbody 321.

According to an embodiment, the light collecting member 320 furtherincludes a reflective member 323. The reflective member is disposed on asurface other than the light input surface LS1 and the light outputsurface LS2 of the light collecting body 321. The reflective member 323may be coated as a reflective layer, may be attached in the form of areflective sheet, or may be provided in the form of a reflectiveadhesive tape. The reflective member 323 may be omitted.

According to embodiments, the interior of the light collecting body 321may be vacant or may be filled with other materials. For example, theinterior of the light collecting body 321 may be a vacuum or may befilled with air or other gases.

According to an embodiment, a light-modulating structure 322 such as arefractive pattern or a reflective pattern is disposed in the lightcollecting body 321, For example, a prism pattern can be disposed in thelight collecting body 321 as the light-modulating structure 322. Asloped surface of the prism pattern is inclined with respect to thelight input surface LS1 of the light collecting body 321. An inclinationangle may be, for example, 45°, but embodiments of the presentdisclosure are not limited thereto. The prism pattern may be formed ofthe same material as the light collecting body 321, or of a differentmaterial. The prism pattern may be formed of a transparent material.

According to an embodiment, the interior of the light collecting body321, other than the light-modulating structure 322, has a refractiveindex different from that of the light collecting body 321 and thelight-modulating structure 322. For example, the interior of the lightcollecting body 321, except for the light-modulating structure 322, canbe a low refractive medium having a refractive index less than the lightcollecting body 321 itself and the light-modulating structure 322.

Since at least one surface of the light-modulating structure 322contacts the low refractive medium, light transmission, reflection, orrefraction occurs on the surface according to Snell's Law. When thesloped surface of the prism pattern of the light-modulating structure322 is adjusted to totally reflect light vertically incident thereon,the leakage light L2 incident on the incident surface of the lightcollecting body 321 is totally reflected from the sloped surface of theprism pattern, such that a light propagation path changes to a directionsubstantially perpendicular with respect to the incident direction ofthe leakage light L2. Thus, light may be transmitted to the light sensor310 on one side of the light collecting member 320.

According to an embodiment, the prism pattern of the light-modulatingstructure 322 is disposed along each column or row of the pixelscorresponding thereto, in one-to-one correspondence. By disposing theprism pattern of the light-modulating structure 322 in this pattern,light leaking from the respective pixels may be transmitted to the lightsensor 310.

In addition, according to an embodiment, light that is totally reflectedfrom one light-modulating structure 322 can be incident onto an adjacentlight-modulating structure 322. Thereafter, when the light propagationpath changes due to Snell's Law, light may enter a bottom surface of thelight collecting body 321, and if the reflective member 323 is disposedon the bottom surface of the light collecting body 321, light can bereflected from the reflective member 323 to the light sensor 310.

According a modified embodiment of the present disclosure, the interiorof the light collecting body 321 is filled with the same material asthat forming the light collecting body 321. In this case, the refractiveindex of the light-modulating structure 322 inside the light collectingbody 321 may be adjusted to implement light collecting effects similarto those described above.

FIG. 10 is a cross-sectional view of a light sensing member of anorganic light-emitting diode display device according to anotherexemplary embodiment of the present disclosure.

Referring to FIG. 10, a light sensing member 301 according to anexemplary embodiment differs from the embodiment of FIG. 9 in that alight-modulating structure 322_1 of a light collecting member 320_1 hasa single continuous sloped surface, regardless of the pixel divisions.The sloped surface may reflect or totally reflect vertically incidentlight L2. An inclination angle (θ) may be an acute angle. Theoretically,when the inclination angle (θ) is 45°, a propagation direction ofvertically incident leakage light L2 changes to a horizontal direction,such that light is transmitted to the light sensor 310. However,embodiments of the present disclosure are not limited thereto, and forother inclination angles (θ), the amount of light transmitted to thelight sensor 310 can be increased by horizontally inclining thepropagation direction of light L2. Moreover, even if reflected light L2is re-directed toward the light input surface LS1 of the lightcollecting body 321, since an incident angle with respect to a normal ofthe light input surface LS1 has increased, the possibility of totalreflection increases. Thus, leakage light L2 may be directed toward thelight sensor 310.

In addition, according to an embodiment, when light reflected from apixel disposed away from the light sensor 310 propagates to the lightsensor 310, the light does not pass through the light-modulatingstructure again. Thus, unlike the embodiment of FIG. 9, it isunnecessary to form the light-modulating structure of a transparentmaterial. Further, a reflective member may be disposed on the slopedsurface.

FIG. 11 is a cross-sectional view of a light sensing member of anorganic light-emitting diode display device according to anotherexemplary embodiment of the present disclosure.

Referring to FIG, 11, a light sensing member 302 according to theexemplary embodiment is substantially identical to the embodiment ofFIG. 10 in that a light-modulating structure 322_2 of a light collectingmember 320_2 has a single, continuous sloped surface regardless of pixeldivisions, but differs from the embodiment of FIG. 10 in that aninclination angle of the sloped surface decreases with decreasingdistance to the light sensor 310. According to an embodiment, the slopedsurface of the light-modulating structure 322_2 is a concave curvedsurface.

FIG. 12 is a cross-sectional view of a light sensing member of anorganic light-emitting diode display device according to anotherexemplary embodiment of the present disclosure.

Referring to FIG. 12, a light sensing member 303 according to anexemplary embodiment is substantially identical to the embodiment ofFIG. 10 in that a light-modulating structure 322_3 of a light collectingmember 320_3 has an single, continuous sloped surface, but differs fromthe embodiment of FIG. 10 in that the sloped surface includesalternately disposed first and second surfaces 322_3 a and 322_3 b withdifferent inclination angles.

According to an embodiment, the inclination angle of the first surface322_3 a is optimized to change the propagation direction of verticallyincident leakage light L2 to a horizontal direction. For example, theinclination angle of the first surface 322_3 a is 45°.

The inclination angle of the second surface 322_3 b can be set within arange that does not block light L2 propagating horizontally from theadjacent first surface 322_3 a. For example, the inclination angle ofthe second surface 322_3 b can be in a range of about 0° to about 10°.If the inclination angle of the second surface 322_3 b is 0°, the secondsurface 322_3 b is a horizontal surface in a strict sense.

According to an embodiment, a width of a repeating unit of the firstsurface 322_3 a and the second surface 322_3 b is identical to a pitchof the pixels corresponding to the repeating unit. The second surface322_3 b may overlap the first electrode 110 of the organiclight-emitting device, and the first surface 322_3 a may overlap thepixel defining layer 160. However, embodiments of the present disclosureare not limited thereto. The relative positions of second surface 322_3b and the first surface 322_3 a may be reversed, or may partiallyoverlap the first electrode and the pixel defining layer, respectively.

The embodiment of FIG. 10 illustrates that light is effectivelycollected as the inclination angle of the sloped surface approaches 45°.However, as the inclination angle of the sloped surface approaches 45°,a thickness of the light-modulating structure approximates a length ofthe light-modulating structure. However, according to an embodiment ofFIG. 12. if the first surface 322_3 a has an inclination angle of orclose to 45° and is disposed in a region that receives a considerableamount of leakage light L2, while the second surface 322_3 b has aninclination angle of or close to 0° and is disposed. in a region thatdoes not receive leakage light L2, the light sensing member 303 canefficiently collect light, and the thickness of the light-modulatingstructure 322_3 can be reduced.

FIG. 13 is a cross-sectional view of a light sensing member of anorganic light-emitting diode display device according to anotherexemplary embodiment of the present disclosure.

Referring to FIG. 13, a light sensing member 304 according to anexemplary embodiment differs from the embodiment of FIG. 9 in that thereis a light collecting member 320_4 with a light-modulating structure322_4 that uses a light scattering member. The light scattering memberscatters vertically incident light L2 to thereby change a lightpropagation path. The changed propagation path of light L2 may bedirected directly to the light sensor 310, or may be reflected ortotally reflected from the interior of the light collecting body 321 tothereby propagate to the light sensor 310.

According to an embodiment, the light scattering member includes lightscattering particles. The light scattering particles may be organicbeads or inorganic beads. The light scattering particles are formed of amaterial having a refractive index that differs from that of theinterior portion of the light collecting body 321. The light scatteringmember is disposed adjacent to the rear of the light collecting body321.

FIG. 14 is a cross-sectional view of a light sensing member of anorganic light-emitting diode display device according to anotherexemplary embodiment of the present disclosure.

Referring to FIG. 14, a light sensing member 305 according to theexemplary embodiment differs from the embodiment of FIG. 9 in that thelight sensor 310 is disposed at the rear of a light collecting member320_5. That is, for example, the light collecting member 320_5 and thelight sensor 310 are sequentially disposed on the rear surface of thefirst substrate 100. The light sensor 310 may be disposed on a rearsurface adjacent to one side of the light collecting member 320_5.

According to an embodiment, there is a light-modulating structure 322_5inside the light collecting body 321 that includes a first light pathchanging structure 322_5 a, such as the prism pattern of FIG. 9, thatchanges a light path to a horizontal direction, as well as a secondlight path changing structure 322_5 b that changes a light path to avertical direction. The first light path changing structure 322_5 areflects leakage light L2 toward one side of the light collecting body321, as in the embodiment of FIG. 9. The second light path changingstructure 322_5 b is disposed in the inner portion of the lightcollecting body 321 and changes a propagation direction of reflectedlight L2 toward the bottom surface of the light collecting body 321. Thepropagation direction of light L2 is changed to be directed to the lightsensor 310 at the rear of the light collecting member 320_5, which canmeasure luminance.

In an exemplary embodiment, the light input surface LS1 of the lightcollecting body 321 is a top surface and the light output surface LS2thereof is a portion of a bottom surface. Thus, if the light collectingmember 320   5 further includes a reflective member 323_1, thereflective member 323_1 can be disposed on all side surfaces and thatportion of the bottom surface other than the light output surface LS2,of the light collecting body 321.

FIG. 15 is a cross-sectional view of a light sensing member of anorganic light-emitting diode display device according to anotherexemplary embodiment of the present disclosure.

Referring to FIG. 15, a light sensing member 306 according to anexemplary embodiment differs from the embodiment of FIG. 9 in that thereis a light-modulating structure 322_) inside the light collecting body321 that further includes a light path changing structure 322_6 a, suchas the prism pattern of FIG. 9, that changes a light path to ahorizontal direction, as well as a light-focusing structure 322_6 b. Thelight path changing structure 322_6 a reflects leakage light L2 towardone side of the light collecting body 321, like the embodiment of FIG.9. The light-focusing structure 322_6 b is disposed between the lightsensor 310 and the light path changing structure 322_6 a. Thelight-focusing structure 322_6 b can focus light L2. received from thelight path changing structure 322 6 a toward one point to therebyprovide light to the light sensor 310. In this manner, focusing lightimproves light-collection and reduces an area of an active region of thelight sensor 310.

The light-focusing structure 322_6 b may be a micro-lens, a lenticularlens, a concave lens, a convex lens, etc.

FIG. 16 is a cross-sectional view of a light sensing member of anorganic light-emitting diode display device according to anotherexemplary embodiment of the present disclosure.

According to an embodiment of FIG. 16, a light sensor 311 of a lightsensing member 307 has two or more light-receiving surfaces.

Referring to FIG. 16, the light collecting member 320 of the lightsensing member 307 is overlapped by a sensing-object, such as theafterimage-expected region AIR of FIG. 4. In addition, the light sensor311 is disposed adjacent to one side of the light collecting member 320while being overlapped by a comparative region NIR, a normal imageregion.

According to an embodiment, leakage light L21 received from theafterimage-expected region AIR is transmitted to the light sensor 311through the light collecting member 320 in a manner identical to that ofthe embodiment of FIG. 4. However, leakage light L22 received from thecomparative region NIR does not pass through the light collecting member320 and is provided directly to the light sensor 311. The light sensor311 has two or more light-receiving surfaces and accordingly, can senseboth types of leakage light L21 and L22.

According to an embodiment, the comparative region NIR includes areference pixel for determining a degradation degree in theafterimage-expected region AIR. When light is emitted sequentially fromthe reference pixel and pixels in the afterimage-expected region AIR,the degradation degree can be more precisely compared and analyzed.

For example, first, a data signal is applied to the reference pixel ofthe comparative region NIR, and light is emitted and detected. Then, adata signal is applied to the pixels in the afterimage-expected regionAIR, and light is emitted and detected. Thereafter, the relativeintensities of light detected in the comparative region NIR and theafterimage-expected region AIR are compared to analyze the degradationdegree of the afterimage-expected region AIR, thereby generating acompensation signal.

FIG. 17 is a rear view of an organic light-emitting diode display deviceaccording to another exemplary embodiment of the present disclosure.

Referring to FIG. 17, an organic light-emitting diode display device 502according to the exemplary embodiment differs from the embodiment ofFIG. 3 in that there are a plurality of light sensing members 308disposed to cover the entirety of the display region PA.

According to an embodiment, adjacent light collecting members 320_8 ofthe light sensing members 308 are not be spaced apart from each other.The light sensor 310 is disposed in one side of the light collectingmembers 320_8. The light sensor 310 is disposed in the non-displayregion NPA. Further, the light sensor 310 protrudes outward from a sideof the first substrate 100.

In an embodiment, the light collecting members 320_8 are disposed overthe entire display region PA of the first substrate, to measure lightleakage from all pixel regions.

FIG. 18 is a cross-sectional view of an organic light-emitting diodedisplay device according to another exemplary embodiment of the presentdisclosure.

Referring to FIG. 18, an organic light-emitting diode display device 503according to an exemplary embodiment includes a heat radiating member400 disposed on a rear surface of the first substrate 100. The heatradiating member 400 can emit heat generated from an organiclight-emitting device (OLED) or a driving chip, to the externalenvironment.

According to an embodiment, the heat radiating member 400 contains ahigh thermal conductive material. For example, the heat radiating member400 may contain a metal such as aluminum, copper, silver, etc., or amaterial such as graphite, grapheme, etc.

According to embodiments, the heat radiating member 400 may be a heatradiating panel, a heat radiating sheet, a heat radiating film, a heatradiating layer or the like. In addition, the heat radiating member 400may include several stacked sheets of heat radiating material.

According to an embodiment, the heat radiating member 400 is adhered tothe rear surface of the first substrate 100. The heat radiating member400 is attached to the rear surface of the first substrate 100. The heatradiating member 400 may cover the entirety of the rear surface of thefirst substrate 100 or may be disposed in portions of the rear surfacefrom which light is emitted.

According to an embodiment, if the heat radiating member 400 overlapsthe light sensing member 300, the heat radiating member 400 includes ahole 400 h allowing the light sensing member 300 to be inserted therein.The light sensing member 300 can be inserted into the hole 400 h of theheat radiating member 400 and can be adhered to the rear surface of thefirst substrate 100.

FIG. 19 is a cross-sectional view of an organic light-emitting diodedisplay device according to another exemplary embodiment of the presentdisclosure.

According to an embodiment of FIG. 19, the light sensing member 300 ofan organic light-emitting diode display device 504 is attached to therear surface of the first substrate 100 by an adhesive member 420. In anexemplary embodiment, so that leakage light emitted to the rear surfaceof the first substrate 100 can pass through the adhesive member 420 tothe light sensing member 300, the adhesive member 420 is formed of atransparent material. The adhesive member 420 may contain an adhesivematerial or a bonding material and may be provided as an adhesive layer,a double-sided adhesive tape, etc.

FIG. 19 illustrates a case in which a thickness of the adhesive member420 is identical to a thickness of the heat radiating member 400, andthe light sensing member 300 further protrudes to the rear from the heatradiating member 400; however, embodiments are not limited thereto, andthe thicknesses and relative positions in the rear direction of themembers can be variously modified.

FIG. 20 is a cross-sectional view of an organic light-emitting diodedisplay device according to another exemplary embodiment of the presentdisclosure.

Referring to FIG. 20, an organic light-emitting diode display device 505according to an exemplary embodiment differs from the embodiment of FIG.18 in that a heat radiating member 401 includes a recessed groove 401 rso that the light sensing member 300 can be inserted into the groove 401r. The light sensing member 300 is enclosed by the rear surface of thefirst substrate 100 and the beat radiating member 401.

According to a modified embodiment, a light sensing member is attachedto the rear surface of the first substrate by an adhesive member, as inthe embodiment of FIG. 19.

As set forth above, a light sensing member of an organic light-emittingdiode display device according to exemplary embodiments of the presentdisclosure, can directly receive leakage light even for a top emissiontype organic light-emitting diode display device, to effectively detectlight without loss of leakage light.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the spirit and scope ofembodiments of the present disclosure as defined by the appended claims.

What is claimed is:
 1. An organic light-emitting diode display device,comprising: a first substrate that includes a display region with aplurality of pixels and a non-display region in a periphery of thedisplay region; a first electrode disposed on the first substrate; asecond electrode opposed to the first electrode; an organiclight-emitting layer disposed between the first electrode and the secondelectrode; and at least one light sensing member disposed on a rearsurface of the first substrate that overlaps the display region, whereinthe light sensing member includes a light sensor and a light collectingmember that transmits light received from the first substrate to thelight sensor.